Flexible fieldbus connection
Flexible printed circuit boards represent a highly developed technology in the field of printed circuit board manufacture. This technology is suited to solve the problem of lack of space with the bus connection of sensors.
For this reason, KUNBUS GmbH has created the development project "KUNBUS- ICflex".
The aim is for example to render the sensors directly PROFIBUS-enabled.
Conventional KUNBUS-IC fieldbus modules in DIL23 format have a footprint of 45x24mm. For larger sensor housings, these modules can be inserted easily. By means of a uniform pin-out on the application side, the KUNBUS-IC modules also permit easy conversion between the individual fieldbuses like CANopen, PROFIBUS, and DeviceNET.
However, even the DIL23 format is still too large for many sensor housings.
This made KUNBUS GmbH to start a development project in order to accommodate fieldbus integration on a flexible printed circuit board.
The advantages are apparent:
Space and weight savings - Up to 60 % of real estate and weight can be saved by using flexible printed circuit boards. A single flexible layout can replace several boards, cables, and plugs and this can create a potential for optimum product design.
Safe installation – Because of its shape, the printed circuit board can be installed only in a single defined position. This avoids installation and wiring errors and minimizes test expenses.
Environmental conditions – Due to the manufacturing technology, the printed circuit boards can even be used in any rough environments. This applies for climatic and mechanical loads.
The limiting factors are the employed microprocessors, voltage transducers, and the optical couplers for the galvanic separation of the application from the fieldbus side.
A still larger advantage is that KUNBUS GmbH can merge the sensor electronics with the fieldbus connection in the framework of a customer-specific development. This saves even more space and is more cost-effective than a two-board solution, since connector and conductor components can fall away.
Such customer-specific solution includes the complete circuit development, fieldbus integration, and production, including 100% output testing.
The product then is supplied plug & play-ready to the customer.
The development project is planned for a period of ten months, and interested sensor manufacturers are invited to participate.
2011 A.Mueller
Photo: Courtesy of www.sitomatic.nl
